YAMAHA 3D Hybrid optical inspection system (AOI) YSi-V（USED）
（This product is a used device and has a significant price advantage when purchased from China, For specific transaction procedures, please contact customer service： service@smtfuture.com）.
Includes 2 dimensional inspections, 3 dimensional inspections and 4-way oblique imaging inspections all in one unit! TypeHS2 realizes highest level inspection speed by further accelerating TypeHS.
3D Height, and sloped surface 3-dimensional inspections (option)
4D∠ 4-direction angular camera (option)
Recommend for Such Production Site
For customers who want to do all types of high-accuracy inspections on a single machine.
In addition to 2D and 3D inspections, it also has a 4-way angular image inspections making this one unit an all-around inspection device
2D inspection functions
Has a high resolution camera with 120 million pixels and high-rigidity frame equivalent to that of mounters, and provides high repeatability.
Equipped with telecentric lens for capturing highly detailed external images at high resolution of７μm（0201mm to …) and high speed（0402mm to …）
Makes automatic inspection settings with an imaging optical inspection algorithm for the 3 values of brightness, color and form inherited from YSi series technology.
Makes feature inspections combining multiple types from 10 images, white color 3-stage LED: Upper stage (H) Mid-stage (M) Lower stage (L) Red (R) (G) Green (B) Blue (IR) Infrared
CI (Cut In) lighting allows RGB display of solder fillets, FOV method can perform large component inspections by seamless joining of visual field to visual field via a high-rigidity frame
Swivel type laser measurement: Marking unit can measure adjacent components such as tall connectors: Automatically adds PCB name to PCBs having no barcode.
3D inspection functions
By using special features from 2D+3D functions, and IR (infrared) lighting it can make high-accuracy 3D inspections by recognizing the correct PCB height standards for each PCB.
In case of irradiation from 2-way moire fringes, the componential moire fringes in the shadows of large components render no effect so a 4-way angle camera is needed to restore the 3D shape which causes poor performance.
For the TypeHS2 hybrid AOI system, Yamaha developed a dedicated 3D irradiation unit with 7 μm resolution. Using it in combination with high-accuracy mode provides stable measurements ideal for fine-detail component inspections that have now evolved to higher levels than conventional models.
4D inspection functions
Using the 4-directions angled camera to simultaneously capture oblique images during 2D and 3D imaging minimizes tact loss and allows visually verifying NG points without actually having to grip the PCB by hand.
Supports use of auto inspection data and visual inspection of crucial points such as in (solder) bridge inspections to find if any solder is present.
M2M functions
Offline software: P-tool AOI Limited (YSi-OS iPRODB) Repair station (visual decision) Remote station (image decision)
N-point collation software: In addition to before-and-after reflow, SPI, mounter recognition image, and history information are displayed simultaneously on one screen and the problem and timing that caused the problem are analyzed.
As a QA option, after component mounting, the mobile decision software instantaneously sends defect information from the inspection machine as feedback and feed-forward to the mounter and stops the mounter.
The YSi-V is the first in the industry to utilize both a 12Megapixels industrial grade high-resolution camera, along with a high-pixel compatible telecentric lens having the high-resolution indispensable for high-accuracy inspections.
In addition to the 12μm lens, the lineup also includes a 7μm lens that enables higher resolution inspection. Adding a high-speed image processing control system and other features achieves high-speed along with high-accuracy and expanded field of vision.
Provides optimal inspection technique selectable from 5 different methods
3D Height, and sloped surface 3-dimensional inspections(option)
High-speed measurement achieved by raising all viewing field heights.
2-D imaging reliably detects floating or unseated parts etc. even in tough, hard-to-find cases.
The 7μm lens capable of high-definition inspection includes inspection function for ultra-tiny 0201 chips that employs a newly designed high magnification projector.
Components with leads
Chip components
3-dimensional inspection
2-dimensional inspection
4D∠ 4-direction angular camera(option)
Besides 2-dimensional inspection from directly above the PCB, gives batch imaging of the entire field of vision by 4-direction sideview inspection with no tact loss! This also allows visual inspections without having to touch the PCB, since imaging allows checking the PCB in 4 directions just as if you’re holding it in your hand. This also helps prevent operator errors and drastically shortens the process time. Also supports automatic inspections for defects not visible from directly above the PCB such as solder bridges between pins under component bodies.
Latest software solution using AI
Support to boost IQ or Intelligent Quality!
The inspection history management software iProDB lets you monitor the status of mounters, printers, and inspectors all in just a glance! The iProDB amasses test result data to calculates potential trouble warning signs. It gives vital intelligent quality (IT) support it applies to process improvements.
Mobile Judgement and QA option
Inferior images are sent to the operator’s mobile unit via a wireless LAN, which makes it possible to judge pass or fail remotely. The system allows line operators to also make decisions, contributing to labor savings.
Automatic inspection data creation
The system can directly convert all types of data (e.g., CAD, CAM, and mounter data) into inspection data and automatically creates PCB images from Gerber data. The system detects through holes on DIP PCBs automatically and can create inspection data automatically.
AI automatically identifies the component types based on images taken by the camera and applies the optimum component library automatically, contributing to simplifying the inspection data creation.
——-—Specifications———
YSi-V
Applicable PCB mm
L610 x W560mm (Max) to L50 x W50mm (Min) (Single lane)
Note : L750mm long length PCBs available (option)
Number of pixels
12Megapixels
Resolution
12μm / 7μm
Target items
Components status after mounting, components status and solder status after hardening
Power supply
3-Phase AC 200/208/220/240/380/400/416V ±10% 50/60Hz
Air supply source
0.45MPa or more, in clean, dry state
External dimension
L1,252 x W1,498 x H1,550mm (excluding protrusions)
Weight
Approx. 1,300kg
*Specifications and appearance are subject to change without prior notice.
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